Gyeonggi Province announced that the ‘2024 Next-Generation Semiconductor Packaging Industry Exhibition’ held at the Suwon Convention Center on the 3rd concluded with the participation of approximately 11,000 visitors.

This year, 58 companies participated in the three-day industrial fair through exhibitions, international forums, and side events, and 61 consultations were held to seek cooperation and business opportunities.

In particular, 168 semiconductor-related industry, academia, and research institutions, including domestic companies such as Samsung Electronics, SK Hynix, and Femtron, universities such as Ajou University and Korea National University of Engineering and Technology, the Next Generation Convergence Technology Research Institute, and the Korea Institute of Nanotechnology, participated by setting up 328 booths.

Gyeonggi Province predicted that this industrial exhibition would create opportunities for innovation in semiconductor packaging technology and strengthening international competitiveness.

Hong Seong-ho, head of the Gyeonggi Province Semiconductor Industry Division, said, “I hope that this industrial exhibition will serve as a stepping stone to solidify our country’s semiconductor packaging industry’s position in the global market,” and added, “Gyeonggi Province plans to prepare an event with more diverse and useful content next year to lead the development of the semiconductor industry.”

Meanwhile, this event was co-hosted by Gyeonggi Province and Suwon City, organized by Suwon Convention Center and J Expo, and sponsored by the Ministry of Science and ICT, Next Generation Convergence Technology Research Institute, Korea Electronics Technology Institute, Korea Semiconductor Industry Association, Korea Microelectronic Packaging Research Association, Korea Microelectronics and Packaging Society, Korea Assembly Industry Association, Hanyang Advanced Packaging Research Center, and Hanyang University Link 3.0 Project Group.

Semiconductor packaging refers to the process of cutting semiconductors produced in wafer form, connecting electrical wiring, etc., and assembling them into a form that can be mounted on electronic devices. It is also called a post-process because it is the process of processing the wafer after the pre-process of engraving circuits on the wafer.

Reporter Han Chang-yool crh2090@wowtv.co.kr